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Salary
Location
Bayan Lepas, Malaysia
Location
Bayan Lepas
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
Job SummaryLeads the design, development, and governance of automation platforms to improve speed, quality, reliability, and cost efficiency while aligning automation initiatives with global strategie
Reference
8be22e06-65c4-46a4-b880-28585a8698ef
Expiry Date
01/01/0001
Salary
Location
Lviv, Ukraine
Location
Lviv
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
We are looking for a highly motivated Intern/ Working Student who will join our team as a Hardware Test Engineering Intern in Lviv office.The role:Design and develop electronic hardware from concept t
Reference
b363e21e-60fc-433d-a903-16b0fd0ef528
Expiry Date
01/01/0001
Salary
Location
Dresden, Germany
Location
Dresden
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
Job DescriptionManage travel requests, bookings, and expense reporting using the Renesas travel management systemCoordinate shipping orders, including PFI processing and customs number requests with E
Reference
881334e2-1bde-4bd0-9315-b1973747e806
Expiry Date
01/01/0001
Salary
Location
Yonezawa, Japan
Location
Yonezawa
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
【募集背景】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA といった先
Reference
8585ebaa-5360-4bb5-914a-8724365bddee
Expiry Date
01/01/0001
Salary
Location
Yonezawa, Japan
Location
Yonezawa
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
【Background / Position Overview】 We are actively advancing technological innovation in the semiconductor post‑process, with a focus on next‑generation packaging technologies such as Flip Chip and SiP
Reference
65cc2ee4-1273-4c02-8fb4-f00f4c8370e8
Expiry Date
01/01/0001
Salary
Location
Yonezawa, Japan
Location
Yonezawa
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
【Background / Position Overview】 We are actively advancing technological innovation in the semiconductor post‑process, with a focus on next‑generation packaging technologies such as Flip Chip and SiP
Reference
dd83ef9c-700d-4165-9c6c-9cd86c9f62e0
Expiry Date
01/01/0001
Salary
Location
Yonezawa, Japan
Location
Yonezawa
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
【募集背景】 当社では、次世代パッケージ技術（Flip Chip、SiP など）の開発を中心に、半導体後工程における技術革新を積極的に推進しています。 特に AI・高性能コンピューティング（HPC）、車載、IoT 分野においては、より高密度・高信頼性・高放熱性を備えたパッケージ技術が求められており、FCCSP（Flip Chip Chip Scale Package）や FCBGA といった先
Reference
123934d3-60c7-4916-a277-01103131c5f9
Expiry Date
01/01/0001
Salary
Location
Ho Chi Minh, Vietnam
Location
Ho Chi Minh City
Type of Employment
Full-time
Remote
No
Function
Engineering
New Graduate Flag
No
Description
We are seeking a highly motivated and experienced SoC Design Verification Engineer to join our team. In this role, you will lead and contribute to the verification of complex System-on-Chip (SoC) desi
Reference
1361179b-35bb-4235-ae05-30cf0257ac50
Expiry Date
01/01/0001
Salary
Location
Hitachinaka, Japan
Location
Hitachinaka
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
■ 募集背景当社は車載・民生・産業用途向けのマイコン、SoC、アナログ、パワー製品など多様な半導体を製造し、AI、自動車、産業機器などの分野に向けてグローバルに革新的ソリューションを提供しています。事業拡大に伴い、生産工場の前工程（150mm〜300mm）の生産性向上・歩留まり改善・新デバイス向け加工プロセス開発を推進しています。これに伴い、Dry Etch、Lithography などの前工程プ
Reference
bf7eeed0-e51d-4483-9b63-94221ad419b7
Expiry Date
01/01/0001
Salary
Location
Toyosu, Japan
Location
Toyosu
Type of Employment
Full-time
Remote
No
Function
Business Development
New Graduate Flag
No
Description
This role will be responsible for working closely with the Senior Director of Business Development (Corporate Strategy) and assisting in leading and overseeing strategic planning initiatives, with a f
Reference
c42d2534-db63-4080-9651-fac8f86aa122
Expiry Date
01/01/0001
Salary
Location
Bayan Lepas, Malaysia
Location
Bayan Lepas
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
Driving yield improvement activities during new product ramp up and volume production including Foundry Defect Density reduction CIP.Collaborate with the foundry process tech team, Product & test Engi
Reference
40ad0bf7-6ffc-4517-b3d8-760eaf713087
Expiry Date
01/01/0001
Salary
Location
Shah Alam, Malaysia
Location
Shah Alam
Type of Employment
Full-time
Remote
No
Function
Manufacturing
New Graduate Flag
No
Description
Renesas is seeking supplier quality engineer for its AI High Density Power Modules product families. The Subcontractor Quality Engineer is responsible for providing support of Supplier Quality Systems
Reference
089c347f-9fad-4444-99e8-62d9d598eaca
Expiry Date
01/01/0001