Title: ENGINEER, DIE BOND
Telok Panglima Garang, MY
JOB SUMMARY
Provide engineering support and solution to Production line to ensure smooth operation that meet the Quality, Cost ,Delivery (Q,C,D) for Assembly Process.
KEY RESPONSIBILITIES
- Determine optimum process condition through comprehensive evaluation. Establish process condition specification and implement statistics process control to ensure smooth operation.
- Determine controls and treatment to non-conforming products in order to produce best quality product and prevent defect leak out.
- Conduct a comprehensive evaluation and qualification in any new material, equipment or product setup according to QMS requirement.
- Direct or Indirect involvement and full support to company Cost Down and yield improvement activities.
- Periodically analyze and identify key process indicators such as ABL, yield for continuous improvement activity by product, equipment or process control.
- Develop adequate standard operation procedure for operator, tool setter, mold cleaner, FA setter and process checker by equipment type and product process flow.
- Conduct deep analysis in problem solving by such as 8 steps problem solving, FTA, FMEA, why-why analysis and other tools.
- Prepare all necessary analysis report and its recommendations for improvements as and when needed.
- Engage with customer claim investigation & perform related simulations upon request by QCD.
- Perform all other related duties as and when assigned by the Superior/HODs
POSITION/JOB SPECIFICATIONS
Qualification |
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Bachelor’s Degree in Mechanical Engineering or Mechatronics related field from recognized Higher Institution. |
Skills & knowledge Required |
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Experience |
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At least 1 – 2 years experiences in related fields preferably in manufacturing semiconductor and familiar working with high-growth, fast-paced and changing work environment. Experience in supervisory roles would be an added advantage. |