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Title:  Staff Packaging Engineer

Requisition ID:  35879

San Jose, US

Job Function:  Production and Technology

Renesas is a global semiconductor company providing hardware and software solutions for a range of cutting-edge technologies including self-driving cars, robots, automated factory equipment, and smart home applications. We are a key supplier to the world’s leading manufacturers of the electronics you rely on every day; you may not see our products, but they are all around you.


Renesas is a global, multi-billion dollar, publicly-traded company headquartered in Japan, and has subsidiaries in 20 countries worldwide. Renesas is a dynamic, multi-cultural technology company where employees learn, mentor, innovate and thrive. Renesas is extending our share in fast-growing data economy-related markets such as infrastructure and data center, and strengthening our presence in the industrial/IOT and automotive segments. Our solutions drive products developed by major innovators around the world. Join us and build your future by being part of what’s next in electronics.


Job Description:

• New IC Package Development for assigned Business Unit(s) including MEMS & Sensor package development for consumer, industrial, automotive, or medical applications

• Literature survey and industry benchmarking on current state-of-the-art package structures, processes, and materials

• Work with cross functional teams in US, Europe, and Asia to provide new IC Package solutions to Business Units

• Work with Business Units to understand product function, application, and reliability & cost requirements

• Propose new package structures and/or materials to achieve target requirements

• Work with OSATs on package feasibility, risk assessment, DOE, and characterization

• Complete package qualification and transfer to Production Sustaining team



• Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering or similar disciplines

• Solid engineering physics background

• 5+ years of traditional packaging experience such as wafer backgrind, dicing, die attach, flip-chip, wire bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, package singulation etc

• Working knowledge of wire bond, WLCSP, and flip-chip packages

• 5+ years of experience in supplier/OSAT management, NPI, and HVM

• MEMS & Sensor Packaging experience and knowledge of MEMS & Sensor devices, modules, functionality/mechanisms a plus

• Ability to deep dive into new problems and propose solutions

• Research oriented mindset with a bias for action


Equal Opportunity Employer: Disability/Veteran


Nearest Major Market: San Jose
Nearest Secondary Market: Palo Alto