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Title:  Staff Packaging Engineer

Company:  Renesas Electronics America Inc.
Country/Region:  US
State:  California
City:  San Jose
Department: 
Business Unit:  IoT and Infrastructure Business Unit
Office: 
Job Function:  Production and Technology
Job Type:  Permanent
Description: 

Renesas Electronics Americas (REA) is a dynamic, multi-cultural tech company where employees can learn, mentor and thrive. REA brings together the strong financial foundation of a multi-billion-dollar global operation and the flexibility and velocity of a smaller organization. We are developing technologies for the latest advances in mobile computing, secured connected devices, autonomous driving, smart homes and factories and more. Our solutions are at the heart of products developed by the major innovators around the world. Join us and be part of what’s next in electronics.

 

We are looking for a highly-motivated individual to fill an engineering position within our Package Development team in San Jose. This individual will be responsible for basic research on packaging technologies and industry benchmarking. Package development activities include basic package design, manufacturing feasibility, substrate fabrication, wafer bumping, package assembly, and package qualifications. Development package types cover FCCSP, FCBGA, WLCSP, QFN, Sensor, SiP, and Module for new product introductions.


Requirements:

• Master or Ph.D degree from Material Science, Physics, or Chemical Engineering
• 5+ year new package development experience
• Keen on schedule management
• Solid understanding on Statistics and engineering DOE
• Good writing skills
• Good verbal communication skills 

 

We recognize and appreciate the value and contributions of individuals with diverse backgrounds and experiences and welcome all qualified individuals to apply.

 

Equal Opportunity Employer: Disability/Veteran

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Nearest Major Market: San Jose
Nearest Secondary Market: Palo Alto