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Title:  Staff Packaging Engineer

Company:  Renesas Electronics America Inc.
Country/Region:  US
State:  CA
City:  San Jose
Department: 
Business Unit:  Production and Technology Unit
Office:  REA(San Jose)
Job Function:  Production and Technology
Job Type:  Permanent
Description: 

Renesas Electronics Americas (REA) is a dynamic, multi-cultural tech company where employees can learn, mentor and thrive. REA brings together the strong financial foundation of a multi-billion dollar global operation and the flexibility and velocity of a smaller organization. We are developing technologies for the latest advances in mobile computing, secured connected devices, autonomous driving, smart homes and factories and more. Our solutions are at the heart of products developed by the major innovators around the world. Join us and be part of what’s next in electronics.

 

Responsibilities:

  • Design and optimize complex wire bond and flip chip packages, modules and sub-systems for excellent RF, signal and power integrity performance.
  • Work with IC and system design teams in an IC-Package-PCB co-design setting to help floor-plan the chip padding and PCB pinout that facilitates optimized package and module layout.
  • Able to take a package from concept to mass production. That includes package selection, layout, modeling, simulations, optimizations, RFQ and manufacturing risk assessment. Ensure design for manufacturability and meet cost constraints.
  • Build models for packages, boards, connectors, vias, interconnects and other components needed for end-to-end design and signal integrity optimization for serial and parallel interfaces.
  • Expertise at optimizing packages and systems for thermal and thermo-mechanical performance a plus.
  • Work with customers to debug design and performance issues where and when necessary.
  • Develop methodologies and processes to improve SI and PI modeling approaches. Drive towards automation to improve performance and efficiency.

 

Requirements:

  • MSEE required with 6+ years of IC package design and layout, signal integrity modeling and simulation experience.
  • Solid background in Electromagnetics & High Speed Design theory. RF design experience a plus.
  • Able to whip out tools like HFSS, SI-Wave, Q3D, ADS, Hspice, Ansys, Flotherm and solve the problem at hand.
  • Working level knowledge of package and PCB design tools like Cadence Allegro package and PCB designer.
  • Knowledge of assembly and substrate manufacturing processes a big plus.

 

Equal Opportunity Employer: Disability/Veteran