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Title:  Process Engineer - Staff

Company:  Renesas Electronics America Inc.
Country/Region:  US
State:  CA
City:  San Jose
Business Unit:  Production and Technology Unit
Office:  IDT(San Jose)
Job Function:  Production and Technology
Job Type:  Permanent

Renesas Electronics Americas (REA) is a dynamic, multi-cultural tech company where employees can learn, mentor and thrive. REA brings together the strong financial foundation of a multi-billion dollar global operation and the flexibility and velocity of a smaller organization. We are developing technologies for the latest advances in mobile computing, secured connected devices, autonomous driving, smart homes and factories and more. Our solutions are at the heart of products developed by the major innovators around the world. Join us and be part of what’s next in electronics.


Highly skilled modeling/foundry engineer will be responsible for the advancement of Renesas’s power management technology modeling capabilities and process technology support to internal product development teams.  The candidate will work closely with the Technology Team, Product Development Teams, Design Automation Group, Product Engineering Teams, and key external customers to define SPICE modeling strategies, development of new modeling methodologies and advanced tool introductions.  The candidate will be responsible for working closely with Renesas’s internal fabs to develop state-of-art SPICE models of power/high-voltage devices, and Renesas’s BCD/high-voltage foundry partners to drive SPICE model improvements, and provide technical support to enable our design teams to successfully introduce new products that exceed our customer’s performance expectations.



  • Lead the advancement and execution of device modeling capabilities of new BCD and high-voltage technology for power management applications
  • Support SPICE model requirements and process technology needs from power management product development teams, and drive creative solutions to complex problems
  • Evaluate foundry SPICE models and drive foundries to solve modeling issues and advance simulation accuracy
  • Lead test chip/structure design, device characterization, model extraction activities, and new tool introduction to advance internal and foundry capabilities
  • Work with foundry partners and key customers to support BU’s new product introduction
  • Characterize on-volatile memory/EEPROM to support IP and product design



  • MS or PHD in EE or Physics with at least 6 years of device modeling/characterization experience in BCD, high-voltage, LDMOS, bipolar, and CMOS technologies for power management applications
  • MOSFET, Bipolar, and high band gap device physics
  • DC, power, and RF characterization of active & passive devices
  • Well versed in SPICE model extraction, simulation, and EDA tool implementations
  • Test chip layout experience
  • Good written and oral communication and project management skills
  • Preferred knowledge: power/analog circuit design, TCAD, non-volatile memory/EEPROM, CMOS device reliability, RF device modeling, IC process of BCD and high-voltage 


Equal Opportunity Employer: Disability/Veteran