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Title:  Staff Packaging Engineer

Department: 
Location: 

San Jose, US

Job Function:  Production and Technology

Renesas is a global semiconductor company providing hardware and software solutions for a range of cutting-edge technologies including self-driving cars, robots, automated factory equipment, and smart home applications. We are a key supplier to the world’s leading manufacturers of the electronics you rely on every day; you may not see our products, but they are all around you.

 

Renesas is a global, multi-billion dollar, publicly-traded company headquartered in Japan, and has subsidiaries in 20 countries worldwide. Renesas is a dynamic, multi-cultural technology company where employees learn, mentor, innovate and thrive. Renesas is extending our share in fast-growing data economy-related markets such as infrastructure and data center, and strengthening our presence in the industrial/IOT and automotive segments. Our solutions drive products developed by major innovators around the world. Join us and build your future by being part of what’s next in electronics.

 

Job Description:

• New package development for PA Modules and various RF products.
• Literature survey and industry benchmarking on current state-of-the-art package structures, processes, 
  and materials
• Work with cross functional teams in US, Europe, and Asia to provide robust and cost-effective package 
  solutions
• Work with business units to understand product function, application, and reliability, and cost  
  requirements
• Propose new package structures and/or materials to achieve target requirements
• Work with OSATs on package feasibility, risk assessment, DOE, and characterization
• Complete package qualification and transfer to Production Sustaining teams

 

Qualifications

• Solid experience on RF PA Module development and production. 
• Experience in traditional semiconductor assembly process (wafer backgrind, dicing, die attach, 
  flip-chip, wire bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, 
  package singulation, etc.)
• Strong background in surface mount technology and direct experience in SiP and Module
• Ability to deep dive into new problems and propose solutions
• Research oriented mindset with a bias for action

 

Education

PhD (+ 3 years experience), Master’s degree (+ 6 years experience) or Bachelor’s degree (+ 8 years experience) in electrical, mechanical, or materials science.

 

Equal Opportunity Employer: Disability/Veteran

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Nearest Major Market: San Jose
Nearest Secondary Market: Palo Alto