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Title:  Packaging Material Engineer

Country:  MY
City:  Penang
Business Unit: 
Job Function:  Hardware(Analog)
Job Type: 

Packaging Material Engineer

Based in Bayan Lepas, Penang

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, real-time interconnect, wireless power transfer, serial switching, interfaces, battery management ICs, sensor signal conditioner ICs and environmental sensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is available at

IDT knows that talented employees are distinguished in all aspects of life. Our goal is to create an environment where you can grow both personally and professionally. In the fast-moving, ever-changing semiconductor market, the next big idea can go out of you and with IDT you have the possibility to implement it. We give you the tools, support and resources to put great ideas together into successful products.

To further strengthen our Test Backend Team at Penang, we are looking for a Packaging Material Engineer to join our team!

Job Responsibilities:

  • Packaging material qualification and improvement.
  • Product Quality Improvement
  • Continue to drive Quality to achieve zero RMA.
  • RMA investigation.
  • New package setup, buy-off and qualification.

Preferred Skills & Knowledge:

  • Good knowledge and familiar the requirement of all the packaging materials used in semiconductor manufacturing. The requirements inclusive the RoHS, materials and design. E.g. for material are shipping tray & tube, end plug, carrier tape, cover tape, plastic reel, moisture barrier bag, carton box, wafer packaging materials
  • Able to read and update the engineering drawing with AutoCAD software.
  • Able to communicate with corporate NPI team and subcons on packaging materials for new project.
  • Able to work with supplier, subcon and internal IDT team to improve the quality issues related to packaging materials.
  • Able to work with purchasing team to achieve cost saving goal.
  • Able to maintain and update internal system (SAP, Agile,, etc) and document/spec for all the packaging materials.
  • Able to work with corp, subcon and internal IDT team on product marking (laser marking) related issues, included maintain and update internal system/document/spec.

Education and/or Experience:

  • A material science / chemical  Engineering bachelor's degree or equivalent training and 2 years’ experience in semiconductor.


Interested candidates may email your resume to our recruitment team at or apply via IDT Career site by click on this link .

Not interested? We would be most happy to share with you the available job opportunities that we have. Simply drop your resume to us and our representative will contact you for other available exciting opportunities that may suit to your expertise!