Title:  Package Design Engineer for Flip Chip

Requisition ID:  53752
Department:  Package Development Department

Kodaira, Tokyo, JP

Job Function:  Hardware Engineering

Job Type: Permanent  - Full Time 

Travel Required: Up to 25% 

Remote Work Available: No 


Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of the electronics you rely on every day; you may not see our products, but they are all around you.


Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.








東京都小平市 もしくは 国内組立製造拠点(大分県中津市)




・半導体パッケージ OSATとの業務経験


 ANSYS, FloTHERMなどによる、電気、熱、応力シミュレーションの業務経験



英語:ビジネス会話ができる (TOEIC 700点程度)