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Title:  Package Engineer for Automotive Analog and Power devices

Requisition ID:  39016
Department:  Package Development Department

Japan, JP

Job Function:  Hardware Engineering

Job Type: Permanent  - Full Time 

Travel Required: Up to 25% 

Remote Work Available: No 


Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of the electronics you rely on every day; you may not see our products, but they are all around you.


Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.



Renesa is requiring package engineers who possess integlation skill of package development to enhance production capability and package cost down for Analog and Power package utilizing global OSAT(OutSouceing Assembly and Test).


【Job Responsibilities】

Analog and Power package development for automitive
・Leadflame design,package materials and structure optimizatrion for QFP and QFN.
・ OSAT selection from the viewpoint of QCD , and package evaluation and qualification for mass production
・Integrate package development with OSAT and related department inhouse to follow IATF16949


【Required Skills and Work Experience】


・Design and development experience of semiconductor package 
・Experience to colaborate with OSAT for semiconductor package  


・Experience of package development with lead flame or for automotive
・Management skill for semiconductoir package development


【Required Language Skills】

English: Daily conversation (TOEIC score 600)

Japanese:Business conversation