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Title:  Packaging Engineer - Principal

Company:  Renesas International Operations Sdn. Bhd.
Country/Region:  MY
State:  Perak
City:  IPOH
Business Unit:  Production and Technology Unit
Office:  MÝ, Ipoh (RIO)
Job Function:  Production and Technology
Job Type:  Permanent


In this role, you will be responsible for packaging design, development and new product introduction You will work with multi-functional teams and drive package integration efforts, package and enabling technology development. A major part of the role includes leading OSATs toward Automotive, chip scale packaging processes (flip chip on lead), including setting & documenting package specifications and design rules, assembly process troubleshooting, new assembly technology development, managing yield and ramp toward NPI & volume production.



  1. Masters / Bachelor’s degree in disciplines of Physics, Chemistry, Mechanical, Material Engineering or equivalent.
  2. Minimum 3+ years of work experience in packaging and assembly engineering. Working knowledge of Automotive requirement is preferred.
  3. Team player with positive attitude, self-driven proactive mindset, and innovative outlook.
  4. Excellent communication and presentation skills (written and verbal) are required.
  5. Demonstrated experience with IC packages such as QFP, QFN, BGA, flip chip, wafer level packaging (FO, WLCSP) or modules.
  6. Demonstrated experience in Statistical Analysis and Design of Experiment is a plus.
  7. Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.



  1. Responsible for leading packaging projects ensuring that all packaging deliverables are met for New Product and New Technology Introductions (NPI, NTI).
  2. Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost.
  3. Develop DOE’s and tests to evaluate suitability and reliability of package solutions.
  4. Coordinate package related activities across multiple organizations including Marketing, Design, Applications, Test, Assembly Engineering, Quality, and Manufacturing (internal and external factories).
  5. Address and solve materials and processing issues that may occur during the development process.
  6. Conduct and approve packaging proposals, designs, schematics, process flows, risk assessments, technical specifications, reliability requirements, data collection, and analysis
  7. Drive IC packaging initiatives from product qualification to high volume ramp for next generation devices
  8. Collaborate with foundry, product engineering and OSAT suppliers to define process flow, process control, tool qualifications to enable high volume manufacturing
  9. Define and implement new Packaging design and process capabilities through generating or updating ECN controlled documentation such as Baseline Process Controls and Design Rule documents
  10. Design new package technologies incorporating new materials and process development to provide high thermal and high reliability solutions for micro-module packaging
  11. Develop and implement design rules and other specifications for the new technologies and designs and manage the New Product Introduction (including product reliability testing, manufacturing risk assessment) at the assembly factories
  12. Generate required data and documentation for the fabrication, assembly and customer application data sheets of the new package technology