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Title:  Package Development Engineer

Company:  Renesas Electronics (Penang) Sdn. Bhd.
Country/Region:  MY
State:  Penang
City:  Bayan Lepas
Business Unit:  Production and Technology Unit
Office:  REPG (Penang)
Job Function:  Production and Technology
Job Type:  Permanent

Your new role:

  • Responsible to plan, manage and execute NPI projects according to timeline and resources available
  • Transition NPI projects related to new IC packages or processes into production environment
  • Enable new package development (and/or technology) with OSAT
  • Interface with OSAT and cross-functional team to build engineering, customer and qualification samples
  • Prepare and manage safe launch and pilot runs of the NPI projects
  • Accountable and drive for the achievement of project targets in terms of quality and time-to-market.
  • Define, update, maintain and apply design rules based on established baseline, specific equipment and process capability
  • Prepare and update specifications required for assembly builds prior to product loading
  • Assess the reliability risks of new integrated solutions associated with new foundry processes and materials when integrated to current package technology
  • Performs industry benchmarking through literature survey and competitive analysis


Who we need:

  • An engineer with Degree/Masters in Materials or Mechanical Engineering
  • Strong project management and flip-chip or WLCSP bumping process knowledge
  • Experience in package substrates such as MSAP, ETS and Tenting processes
  • At least 3 years of IC package development experience


Extra awesome if you have:

  • Experience with OSAT and project management will be an added advantage
  • Knowledge on SMT and board level reliability optimization is a good additional advantage