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Title:  Staff Engineer 2

Company:  Renesas Electronics India Pvt. Ltd.
Country/Region:  IN
State: 
City:  Bangalore
Department:  RF Communications Department
Business Unit:  IoT and Infrastructure Business Unit
Office: 
Job Function:  Hardware (Digital)
Job Type:  Permanent
Description: 

Job Title: Staff Engineer 2

Work Location: Bangalore

 

- Design and optimize complex wirebond and flip chip packages, modules and sub-systems for excellent RF, signal and power integrity performance.

- Work with IC and system design teams in a IC-Package-PCB co-design setting to help floor-plan the chip padring and PCB pinout that facilitates optimized package and module layout.

- Able to take a package from concept to mass production. That includes package selection, layout, modeling, simulations, optimizations, RFQ and manufacturing risk assessment. Ensure design for manufacturability and meet cost constraints.

- Build models for packages, boards, connectors, vias, interconnects and other components needed for end-to-end design and signal integrity optimization for serial and parallel interfaces.

- Expertise at optimizing packages and systems for thermal and thermo-mechanical performance a plus.

- Work with customers to debug design and performance issues where and when necessary.

- Develop methodologies and processes to improve SI and PI modeling approaches. Drive towards automation to improve performance and efficiency.

 

 

* MSEE required with 5+ years of IC package design and layout, signal integrity modeling and simulation experience.

* Solid background in Electromagnetics & High Speed Design theory. RF design experience a plus.

* Able to whip out tools likes HFSS, SI-Wave, Q3D, ADS, HSpice, Ansys, Flotherm and solve the problem at hand.

* Working level knowledge of package and PCB design tools like Cadence Allegro package and PCB designer.

* Knowledge of assembly and substrate manufacturing processes a big plus.