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Title:  半導体製造後工程開発エンジニア(ダイボンディングプロセス)

Requisition ID:  51007
Department:  Process Engineering Department

Takasaki, 10, JP

Job Function:  Process Engineering

Job Type: Permanent  - Full Time 

Travel Required: Up to 25% 

Remote Work Available: Yes 


Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of the electronics you rely on every day; you may not see our products, but they are all around you.


Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.




国内自家拠点展開だけでなく、国内外OSAT・各種設備メーカー・材料メーカーとも協業するなど、World wideで活躍できる人材を募集いたします。
















英語 相手の話を聞ける (TOEIC 500点程度)

日本語 ビジネス会話ができる